Powrót do wyników wyszukiwania Dodane 5 października 2016

Package Design Engineer - Oferta z Jobs.pl

Produkcja, Przemysł » Produkcja, Przemysł - inne

  • Województwozagranica
  • Miejscowośćinne
  • AdresFrance
Dodaj do:



Package Design Engineer

Nr ref.: /JOBS.pl

  • Packaging Design Engineer

    Grenoble, France

    6 month contract or Perm

    Euros Open depending on exp.

    The Company

    A leading semiconductor company

    The Role

    • Management of the full design flow of organic and ceramic multi-layers microelectronics packaging (BGA, PGA, CLCC, CQFP, WLCSP):
      • Identify customers' needs
      • Devise a solution and a specification
      • Interact with packaging manufacturers to obtain a solution and a quote all along the design process
      • Interacting with project teams (sensor designers, project manager, )
      • Implement the design + routing of the package in accordance with the constraints and timing as originally defined.
      • Conduct, electrical, thermal and mechanical simulations when necessary
      • Conduct DRC checks in accordance with e2v methodologies.
      • Conduct different design reviews including the final one before ordering the package
      • Assume the role of design expert with respect to assembly teams (assembly instructions, )
    • Ensure technical interface with package vendors and assembly houses:
      • Guide technical reviews with package vendors
      • Technical Identification and evaluation of new vendors
    • Technology watch:
      • Maintain a technology watch on future generations of imaging packages
      • Identify and lead R&D or continuous improvement projects on these technologies

    The Individual

    • At least 5-years of packaging design experience. A specific experience in imaging and/or assembly would be a plus
    • Mastering of package design flow: specification, identifying solutions, design, validation
    • Mastering packaging layout (under Cadence APD or equivalent)
    • Training background in electronics (preferred) or material science or micromechanics
    • Knowledge in basic mechanical design (solidworks or equivalent)
    • Experience in technical management of package vendors and assembly houses.
    • A plus would be knowledge in electrical modelisation (parasitic extraction under Cadence Xtract IM, Spice, Ansys) and a knowledge in thermal modelisation (Ansys workbench, Cadence)
    • An experience in system and sub-system development would be appreciated


Aplikuj teraz

Ogłoszenie pochodzi z serwisu Jobs.pl.

najnowsze ogłoszenia w tej kategorii

Proszę czekać - ładowanie treści...